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(layer "F.Cu" (type "copper") (thickness 0.035) ) (layer "dielectric 1" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02) ) (layer "In1.Cu" (type "copper") (thickness 0.035) ) (layer "dielectric 2" (type "core") (thickness 1.24) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02) ) (layer "In2.Cu" (type "copper") (thickness 0.035) ) (layer "dielectric 3" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02) ) (layer "B.Cu" (type "copper") (thickness 0.035) ) (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01) ) (layer "B.Paste" (type "Bottom Solder Paste") ) (layer "B.SilkS" (type "Bottom Silk Screen") (color "White") ) (copper_finish "HAL lead-free") (dielectric_constraints no) ) (pad_to_mask_clearance 0.038) (allow_soldermask_bridges_in_footprints no) (tenting front back) (pcbplotparams (layerselection 0x00000000_00000000_55555555_5755f5ff) (plot_on_all_layers_selection 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