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| author | Sam Anthony <sam@samanthony.xyz> | 2025-10-13 13:17:11 -0400 |
|---|---|---|
| committer | Sam Anthony <sam@samanthony.xyz> | 2025-10-13 13:17:11 -0400 |
| commit | 98c0e2281060f9fea3f82f4c28223a2fd3b983dd (patch) | |
| tree | 9d8a1d8206efef1dd74307756b1f6dac4b135d97 /midterm_report | |
| parent | 9f2e8aa64e223c7060f43416fa696ddf073e0e17 (diff) | |
| download | can-gauge-interface-98c0e2281060f9fea3f82f4c28223a2fd3b983dd.zip | |
midterm report: pcb design
Diffstat (limited to 'midterm_report')
| -rw-r--r-- | midterm_report/midterm_report.tex | 77 | ||||
| -rw-r--r-- | midterm_report/references.bib | 21 |
2 files changed, 93 insertions, 5 deletions
diff --git a/midterm_report/midterm_report.tex b/midterm_report/midterm_report.tex index 91427e5..8c7e3f0 100644 --- a/midterm_report/midterm_report.tex +++ b/midterm_report/midterm_report.tex @@ -69,7 +69,14 @@ The microcontroller is at the heart of the design. A Microchip PIC16F1459 was chosen because of its simplicity, robustness, feature set, and low cost \cite{pic16f1459}. It is an 8-bit microcontroller that features a USB peripheral, an SPI peripheral for communicating with the other ICs, and timers for waveform generation. The PIC is a proven design that Microchip recommends for automotive applications. -It is available in a DIP package, making it convenient for prototyping on a breadboard. +It is available in a DIP package, making it convenient for prototyping on a breadboard (fig. \ref{fig:pic}). + +\begin{figure} + \centering + \includegraphics[width=0.5\textwidth]{"pic16f1459.png"} + \caption{Microchip PIC16F1459 8-bit microcontroller.} + \label{fig:pic} +\end{figure} A Microchip MCP2515 serves as the CAN controller \cite{mcp2515}. It supports CAN 2.0B and it has an SPI interface for communicating with the PIC. @@ -107,7 +114,8 @@ The MCP4912 incorporates two DACs in a single chip, so there are two chips per b \subsection{Power supply} The ICs require a 5V supply. -A 12V automotive electrical system operates between 9--16V, with a nominal voltage of $\sim$14V. + +A 12V automotive electrical system operates between 9--16V, with a nominal voltage of $\sim$13.7V. The voltage ripple is often quite significant as well. Thus, the power supply must be very robust to supply a stable voltage to the ICs. @@ -122,13 +130,74 @@ The power dissipation of a linear regulator is linear in $V_\text{Drop}$: The load current is estimated to be $\le 250$mA \cite{power_budget}. That means a linear regulator would dissipate up to $11\text{V} \times 0.250\text{A} = 2.75$W. That amount of power from a tiny chip would be difficult to cool. -Thus, a switching regulator is right for this design. +Thus, a switching regulator is the right choice for this design. + +The downside of a switching regulator is that it produces a lot of noise in the PDN (power distribution network). +To isolate the other components from this noise, a two-stage PDN is used. +The first stage is the switching regulator itself, also known as a buck converter. +The buck drops the voltage from 12V down to 7V. + +The second stage is composed of two linear regulators: one for the digital circuitry, and one for the analog circuitry. +Just like a buck converter, switched digital ICs introduce noise into the PDN. +Therefore, it is good practice to keep the digital and analog components separate. +The linear regulators drop the voltage from 7V down to the final 5V that the ICs require. +This second stage isolates the ICs from the noisy buck converter, and splitting the stage between two regulators keeps the digital and analog circuits isolated from one-another. -The power supply will discussed further in the next section. +The buck converter is a Texas Instruments TPS5430 \cite{tps5430}. +It is surrounded by a couple of LC and RC networks to regulate the voltage and to dampen the output ripple. +See the datasheet and \cite{power_supply} for the process of selecting the accompanying passive components. +The linear regulators are ST L78M05ABs \cite{l78m}. + +This design is certainly overkill for the application, but it is better than an under-developed PDN that could cause brown-outs during transient loads and variations in the supply voltage. \section{PCB design and manufacture} +KiCad was used to design the schematic (fig. \ref{fig:schematic}) and the PCB (figs. \ref{fig:pcb_pours} \& \ref{fig:pcb_3d}). +JLCPCB was chosen to manufacture the printed circuit board. +At the time of writing, the board design has been finalized and submitted to JLC for manufacturing. +It should arrive any day now. + +\begin{figure} + \centering + \includegraphics[width=\textwidth]{"schematic-v0.2.pdf"} + \caption{schematic} + \label{fig:schematic} +\end{figure} + +\begin{figure} + \centering + \includegraphics[width=\textwidth]{"pcb_pours-v0.2.pdf"} + \caption{PCB front and back copper pours, and drill holes} + \label{fig:pcb_pours} +\end{figure} + +\begin{figure} + \centering + \includegraphics[width=\textwidth]{"pcb_3d-v0.2.png"} + \caption{PCB 3D render} + \label{fig:pcb_3d} +\end{figure} + +The board is a 4-layer design that uses a combination of surface-mount (SMD) and through-hole (THT) components. +The top and bottom layers are for signals, and the two middle layers are solid ground planes. +This ensures that all signal traces' fields are tightly coupled to ground directly above or below. +Power is routed on the bottom layer. + +As mentioned above, most of the ICs are available in DIP (through-hole) packages, and I have been using them for prototyping on the breadboard. +Once the PCB arrives, I can transplant the chips into the board, along with the passive components. + +The power supply parts, on the other hand, are SMD. +It is important to minimize loop distances in power supply circuits. +That is why power regulator chips are generally only available in smaller SMD packages. +The SMD components will be assembled by JLC, as I have neither the equipment nor the skill for SMD soldering. + +The board was layed out with PCB design best-practices in mind. +Traces are widely-spaced to reduce coupling. +All signal vias are accompanied by a ground via to keep the E fields from spreading in the dielectric. +All traces are microstripped above a solid ground plane, again to keep the fields tight and to give the current a return path. +The noisy switching regulator is placed far away from the other components to reduce EMI---the sensitive analog signals and the DACs are far away, on the opposite side of the board. + TODO diff --git a/midterm_report/references.bib b/midterm_report/references.bib index 0687abc..6a019a9 100644 --- a/midterm_report/references.bib +++ b/midterm_report/references.bib @@ -27,6 +27,20 @@ url = {https://www.microchip.com/en-us/product/MCP2561}, urlseen = {2025-10-13}, }, +@online{tps5430, + title = {TPS543x}, + subtitle = {Wide Input Range Step-Down Converter}, + organization = {Texas Instruments}, + url = {https://www.ti.com/lit/ds/symlink/tps5430.pdf}, + urlseen = {2025-10-13}, +}, +@online{l78m, + title = {L78M}, + subtitle = {Precision 500mA Regulators}, + organization = {STMicroelectronics}, + url = {https://www.st.com/en/power-management/l78m.html}, + urlseen = {2025-10-13}, +}, @online{bosch_pst, title = {Pressure Sensor Combined PST-F 1}, organization = {Bosch Motorsport}, @@ -34,7 +48,12 @@ urlseen = {2025-10-13}, }, @misc{power_budget, - title = {Power Budget}, + title = {Power Budget Spreadsheet}, author = {Sam Anthony}, url = {power_budget.ods}, }, +@misc{power_supply, + title = {TPS5430 Power Supply Spreadsheet}, + author = {Sam Anthony}, + url = {power_supply.ods}, +}, |