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-rw-r--r--hw/manufacturing/can_gauge_interface-job.gbrjob173
1 files changed, 0 insertions, 173 deletions
diff --git a/hw/manufacturing/can_gauge_interface-job.gbrjob b/hw/manufacturing/can_gauge_interface-job.gbrjob
deleted file mode 100644
index 795c2b2..0000000
--- a/hw/manufacturing/can_gauge_interface-job.gbrjob
+++ /dev/null
@@ -1,173 +0,0 @@
-{
- "Header": {
- "GenerationSoftware": {
- "Vendor": "KiCad",
- "Application": "Pcbnew",
- "Version": "9.0.0"
- },
- "CreationDate": "2025-10-01T16:31:20-04:00"
- },
- "GeneralSpecs": {
- "ProjectId": {
- "Name": "can_gauge_interface",
- "GUID": "63616e5f-6761-4756-9765-5f696e746572",
- "Revision": "0.2"
- },
- "Size": {
- "X": 97.55,
- "Y": 105.05
- },
- "LayerNumber": 4,
- "BoardThickness": 1.6,
- "Finish": "HAL lead-free"
- },
- "DesignRules": [
- {
- "Layers": "Outer",
- "PadToPad": 0.2,
- "PadToTrack": 0.2,
- "TrackToTrack": 0.2032,
- "MinLineWidth": 0.3048,
- "TrackToRegion": 0.3048,
- "RegionToRegion": 0.3048
- },
- {
- "Layers": "Inner",
- "PadToPad": 0.2,
- "PadToTrack": 0.2,
- "TrackToTrack": 0.2032,
- "TrackToRegion": 0.508,
- "RegionToRegion": 0.508
- }
- ],
- "FilesAttributes": [
- {
- "Path": "can_gauge_interface-F_Cu.gbr",
- "FileFunction": "Copper,L1,Top",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-In1_Cu.gbr",
- "FileFunction": "Copper,L5,Inr",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-In2_Cu.gbr",
- "FileFunction": "Copper,L7,Inr",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-B_Cu.gbr",
- "FileFunction": "Copper,L4,Bot",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-F_Paste.gbr",
- "FileFunction": "SolderPaste,Top",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-B_Paste.gbr",
- "FileFunction": "SolderPaste,Bot",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-F_Silkscreen.gbr",
- "FileFunction": "Legend,Top",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-B_Silkscreen.gbr",
- "FileFunction": "Legend,Bot",
- "FilePolarity": "Positive"
- },
- {
- "Path": "can_gauge_interface-F_Mask.gbr",
- "FileFunction": "SolderMask,Top",
- "FilePolarity": "Negative"
- },
- {
- "Path": "can_gauge_interface-B_Mask.gbr",
- "FileFunction": "SolderMask,Bot",
- "FilePolarity": "Negative"
- },
- {
- "Path": "can_gauge_interface-Edge_Cuts.gbr",
- "FileFunction": "Profile",
- "FilePolarity": "Positive"
- }
- ],
- "MaterialStackup": [
- {
- "Type": "Legend",
- "Color": "White",
- "Name": "Top Silk Screen"
- },
- {
- "Type": "SolderPaste",
- "Name": "Top Solder Paste"
- },
- {
- "Type": "SolderMask",
- "Color": "Green",
- "Thickness": 0.01,
- "Name": "Top Solder Mask"
- },
- {
- "Type": "Copper",
- "Thickness": 0.035,
- "Name": "F.Cu"
- },
- {
- "Type": "Dielectric",
- "Thickness": 0.1,
- "Material": "FR4",
- "Name": "F.Cu/In1.Cu",
- "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
- },
- {
- "Type": "Copper",
- "Thickness": 0.035,
- "Name": "In1.Cu"
- },
- {
- "Type": "Dielectric",
- "Thickness": 1.24,
- "Material": "FR4",
- "Name": "In1.Cu/In2.Cu",
- "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
- },
- {
- "Type": "Copper",
- "Thickness": 0.035,
- "Name": "In2.Cu"
- },
- {
- "Type": "Dielectric",
- "Thickness": 0.1,
- "Material": "FR4",
- "Name": "In2.Cu/B.Cu",
- "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
- },
- {
- "Type": "Copper",
- "Thickness": 0.035,
- "Name": "B.Cu"
- },
- {
- "Type": "SolderMask",
- "Color": "Green",
- "Thickness": 0.01,
- "Name": "Bottom Solder Mask"
- },
- {
- "Type": "SolderPaste",
- "Name": "Bottom Solder Paste"
- },
- {
- "Type": "Legend",
- "Color": "White",
- "Name": "Bottom Silk Screen"
- }
- ]
-}