diff options
Diffstat (limited to 'midterm_report')
| -rw-r--r-- | midterm_report/breadboard.jpg | bin | 0 -> 5239793 bytes | |||
| -rw-r--r-- | midterm_report/midterm_report.tex | 19 |
2 files changed, 13 insertions, 6 deletions
diff --git a/midterm_report/breadboard.jpg b/midterm_report/breadboard.jpg Binary files differnew file mode 100644 index 0000000..e3c5fb3 --- /dev/null +++ b/midterm_report/breadboard.jpg diff --git a/midterm_report/midterm_report.tex b/midterm_report/midterm_report.tex index 27cf6c0..4814914 100644 --- a/midterm_report/midterm_report.tex +++ b/midterm_report/midterm_report.tex @@ -33,7 +33,7 @@ An overview of the system is shown in figure \ref{fig:system}. \begin{figure} \centering \includegraphics[width=\textwidth]{"../proposal/diagram.png"} - \caption{system diagram} + \caption{System diagram.} \label{fig:system} \end{figure} @@ -161,21 +161,21 @@ It should arrive any day now. \begin{figure} \centering \includegraphics[width=\textwidth]{"schematic-v0.2.pdf"} - \caption{schematic} + \caption{Schematic.} \label{fig:schematic} \end{figure} \begin{figure} \centering \includegraphics[width=\textwidth]{"pcb_pours-v0.2.pdf"} - \caption{PCB front and back copper pours, and drill holes} + \caption{PCB front and back copper pours; drill holes.} \label{fig:pcb_pours} \end{figure} \begin{figure} \centering \includegraphics[width=\textwidth]{"pcb_3d-v0.2.png"} - \caption{PCB 3D render} + \caption{3D render of the PCB.} \label{fig:pcb_3d} \end{figure} @@ -184,9 +184,16 @@ The top and bottom layers are for signals, and the two middle layers are solid g This ensures that all signal traces' fields are tightly coupled to ground directly above or below. Power is routed on the bottom layer. -As mentioned above, most of the ICs are available in DIP (through-hole) packages, and I have been using them for prototyping on the breadboard. +As mentioned above, most of the ICs are available in DIP (through-hole) packages, and I have been using them for prototyping on the breadboard (fig. \ref{fig:breadboard}). Once the PCB arrives, I can transplant the chips into the board, along with the passive components. +\begin{figure} + \centering + \includegraphics[width=\textwidth]{"breadboard.jpg"} + \caption{Breadboard circuit for MCP2515 system testing.} + \label{fig:breadboard} +\end{figure} + The power supply parts, on the other hand, are SMD. It is important to minimize loop distances in power supply circuits. That is why power regulator chips are generally only available in smaller SMD packages. @@ -194,7 +201,7 @@ The SMD components will be assembled by JLC, as I have neither the equipment nor The board was layed out with PCB design best-practices in mind. Traces are widely-spaced to reduce coupling. -All signal vias are accompanied by a ground via to keep the E fields from spreading in the dielectric. +All signal vias are accompanied by a ground via to keep the electric fields from spreading in the dielectric. All traces are microstripped above a solid ground plane, again to keep the fields tight and to give the current a return path. The noisy switching regulator is placed far away from the other components to reduce EMI---the sensitive analog signals and the DACs are far away, on the opposite side of the board. |
